Advanced MEMS Packaging

A comprehensive guide to 3D MEMS packaging methods and solutions

Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.

This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored:

Advanced IC and MEMS packaging trends

MEMS devices, commercial applications, and markets

More than 360 MEMS packaging patents and 10 3D MEMS packaging designs

TSV for 3D MEMS packaging

MEMS wafer thinning, dicing, and handling

Low-temperature C2C, C2W, and W2W bonding

Reliability of RoHS-compliant MEMS packaging

Micromachining and water bonding techniques

Actuation mechanisms and integrated micromachining

Bubble switch, optical switch, and VOA MEMS packaging

Bolometer and accelerameter MEMS packaging

Bio-MEMS and biosensor MEMS packaging

RF MEMS switches, tunable circuits, and packaging