Electronic Packaging Materials and Their Properties Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

Michael Pecht und andere
    • 48,99 €
    • 48,99 €

Beschreibung des Verlags

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
interconnections
printed circuit boards
substrates
encapsulants
dielectrics
die attach materials
electrical contacts
thermal materials
solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

GENRE
Gewerbe und Technik
ERSCHIENEN
2017
19. Dezember
SPRACHE
EN
Englisch
UMFANG
128
Seiten
VERLAG
CRC Press
GRÖSSE
10
 MB

Mehr Bücher von Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan

Placement and Routing of Electronic Modules Placement and Routing of Electronic Modules
2020
Electronics Industry in Taiwan Electronics Industry in Taiwan
2020
The Chinese Electronics Industry The Chinese Electronics Industry
2018
Handbook of Electronic Package Design Handbook of Electronic Package Design
2018
The Japanese Electronics Industry The Japanese Electronics Industry
2019
The Korean Electronics Industry The Korean Electronics Industry
2020