Ceva's New Dsp Core Delivers Highest Audio Performance

CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], Mountain View, Calif., a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, has announced the latest addition to its CEVA-TeakLite-III DSP architecture. The CEVA-TL3211 is an advanced DSP targeting the growing needs of low cost smartphones and high-definition (HD) audio features within digital televisions (DTV), set-top-boxes (STB), and Blu-ray Disc players. The CEVA-TL3211 delivers the industry's highest levels of performance, power efficiency, user flexibility, and smallest memory footprint to address the requirements of 2G/3G modems and advanced audio processing, including fully-certified HD audio codecs from Dolby and DTS. This new core has already been adopted by a Tier-1 semiconductor vendor. The new CEVA-TL3211 DSP core is compliant and code compatible with the CEVA-TeakLite-III architecture, which was recently named the industry 'best all around audio processor' in an independent report(1). The CEVA-TL3211 is a 32-bit audio DSP running at 1GHz with a silicon footprint of only 0.2mm^2 when implemented on a 40nm process node. Specifically benefitting the DTV and STB markets, the CEVA-TL3211 runs a complete DTV use-case in less than 200MHz, leaving ample headroom for vendors to run various post-processing functions on the same core, thereby reducing overall cost. For low cost smartphones, the CEVA-TL3211 allows an efficient integration of baseband processing along with application processing related needs like HD audio and voice enhancements such as noise cancellation and beam forming.