Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3

    • USD 239.99
    • USD 239.99

Descripción editorial

The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2024), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 19–20 December 2024. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

GÉNERO
Técnicos y profesionales
PUBLICADO
2025
1 de noviembre
IDIOMA
EN
Inglés
EXTENSIÓN
639
Páginas
EDITORIAL
Springer Nature Singapore
VENDEDOR
Springer Nature B.V.
TAMAÑO
88.3
MB
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