Copper Electrodeposition for Nanofabrication of Electronics Devices Copper Electrodeposition for Nanofabrication of Electronics Devices
Nanostructure Science and Technology

Copper Electrodeposition for Nanofabrication of Electronics Devices

Kazuo Kondo and Others
    • CHF 80.00
    • CHF 80.00

Publisher Description

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:

• ULSI wiring material based upon copper nanowiring
• Printed circuit boards
• Stacked semiconductors
• Through Silicon Via
• Smooth copper foil for Lithium-Ion battery electrodes

This book is ideal for nanotechnologists, industry professionals, and practitioners.

GENRE
Science & Nature
RELEASED
2013
20 November
LANGUAGE
EN
English
LENGTH
290
Pages
PUBLISHER
Springer New York
SIZE
8.7
MB

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