• 97,99 €

Beschreibung des Verlags

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects.  The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications.  Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry.  This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Provides a single-source reference on carbon nanotubes for interconnect applications;Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects;Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

GENRE
Gewerbe und Technik
ERSCHIENEN
2016
9. Juli
SPRACHE
EN
Englisch
UMFANG
345
Seiten
VERLAG
Springer International Publishing
GRÖSSE
9.7
 MB