• 79,99 €

Beschreibung des Verlags

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:

• ULSI wiring material based upon copper nanowiring
• Printed circuit boards
• Stacked semiconductors
• Through Silicon Via
• Smooth copper foil for Lithium-Ion battery electrodes

This book is ideal for nanotechnologists, industry professionals, and practitioners.

GENRE
Wissenschaft und Natur
ERSCHIENEN
2013
20. November
SPRACHE
EN
Englisch
UMFANG
290
Seiten
VERLAG
Springer New York
GRÖSSE
8.7
 MB

Mehr Bücher von Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey & Masayuki Yokoi

Andere Bücher in dieser Reihe