Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of seven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography.