John H. Lau

Livres

Chiplet Design and Heterogeneous Integration Packaging Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
2023
Assembly and Reliability of Lead-Free Solder Joints Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
2020
Heterogeneous Integrations Heterogeneous Integrations
Heterogeneous Integrations
2019
Fan-Out Wafer-Level Packaging Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
2018
3D IC Integration and Packaging 3D IC Integration and Packaging
3D IC Integration and Packaging
2015
Electronics Manufacturing Electronics Manufacturing
Electronics Manufacturing
2002