Packaging of High Power Semiconductor Lasers Packaging of High Power Semiconductor Lasers
Micro- and Opto-Electronic Materials, Structures, and Systems

Packaging of High Power Semiconductor Lasers

Xingsheng Liu et autres
    • 139,99 €
    • 139,99 €

Description de l’éditeur

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

GENRE
Professionnel et technique
SORTIE
2014
14 juillet
LANGUE
EN
Anglais
LONGUEUR
417
Pages
ÉDITIONS
Springer New York
TAILLE
15
Mo

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