Packaging of High Power Semiconductor Lasers Packaging of High Power Semiconductor Lasers
Micro- and Opto-Electronic Materials, Structures, and Systems

Packaging of High Power Semiconductor Lasers

Xingsheng Liu and Others
    • 139,99 €
    • 139,99 €

Publisher Description

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

GENRE
Professional & Technical
RELEASED
2014
14 July
LANGUAGE
EN
English
LENGTH
417
Pages
PUBLISHER
Springer New York
SIZE
15
MB

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