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John H. Lau
Livros
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
2024
Chiplet Design and Heterogeneous Integration Packaging
2023
Assembly and Reliability of Lead-Free Solder Joints
2020
Heterogeneous Integrations
2019
Fan-Out Wafer-Level Packaging
2018
3D IC Integration and Packaging
2015