Wafer Level 3-D ICs Process Technology More Books by Chuan Seng Tan, Ronald J. Gutmann & L. Rafael Reif

Encyclopedia of Packaging Materials, Processes, and Mechanics Encyclopedia of Packaging Materials, Processes, and Mechanics
Encyclopedia of Packaging Materials, Processes, and Mechanics
2019
Physical Design for 3D Integrated Circuits Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits
2017