Kinetic Study of the Effect of Selected Surfactants on Corrosion of Copper (Report‪)‬

INTRODUCTION Copper is one of the preferred metals in industry owing to its excellent electrical and thermal conductivities, good mechanical workability and its relatively noble properties (1-3). Corrosion inhibition of copper in a wide variety of media has attracted the attention of a number of investigators (4 -8). In general, the adsorption of an inhibitor on a metal surface depends on the nature and the surface charge of the metal, the adsorption mode, its chemical structure, and the type of the electrolyte solution (9). It has been accepted that the corrosion inhibition process results from the formation of organic inhibitor films on the metal surface (10) . The anodic dissolution of copper in organic solvent environments is influenced by its concentration (11). In the present work, a study of the inhibiting effect of some inhibitors in case of copper corrosion in different concentrations of phosphoric acid solution was carried out. The aim is to discuss the mechanism of protection given by these organic additives as CPYB and CTAB on the electro-dissolution of copper in [H.sub.3]P[O.sub.4] and the factors that affect corrosion process.