John H. Lau

Books
Electronics Manufacturing Electronics Manufacturing
Electronics Manufacturing
2002
3D IC Integration and Packaging 3D IC Integration and Packaging
3D IC Integration and Packaging
2015
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
2024
Chiplet Design and Heterogeneous Integration Packaging Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
2023
Assembly and Reliability of Lead-Free Solder Joints Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
2020
Heterogeneous Integrations Heterogeneous Integrations
Heterogeneous Integrations
2019