3D IC Stacking Technology

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technology

Practical design ecosystem for heterogeneous 3D IC products

Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack

Process integration for TSV manufacturing

High-aspect-ratio silicon etch for TSV

Dielectric deposition for TSV

Barrier and seed deposition

Copper electrodeposition for TSV

Chemical mechanical polishing for TSV applications

Temporary and permanent bonding

Assembly and test aspects of TSV technology