3D Integration for VLSI Systems 3D Integration for VLSI Systems

3D Integration for VLSI Systems

Chuan Seng Tan and Others
    • $159.99
    • $159.99

Publisher Description

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

GENRE
Science & Nature
RELEASED
2016
April 19
LANGUAGE
EN
English
LENGTH
350
Pages
PUBLISHER
Jenny Stanford Publishing
SELLER
Taylor & Francis Group
SIZE
41.6
MB

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